Advanced Electronic Packaging Technology: From Hard to Soft
Yue Gu, Yongjun Huo
Abstract
Packaging is a pivotal step in electronic device manufacturing, determining the translational performance of bare chips [...].
Topics & Concepts
Electronic packagingManufacturing engineeringMaterials sciencePackaging engineeringIntegrated circuit packagingMechanical engineeringEngineeringComposite materialOptoelectronicsIntegrated circuitAdvanced Sensor and Energy Harvesting MaterialsNanomaterials and Printing TechnologiesAdditive Manufacturing and 3D Printing Technologies