Dual 3D networks of graphene derivatives based polydimethylsiloxane composites for electrical insulating electronic packaging materials with outstanding electromagnetic interference shielding and thermal dissipation performances
S. Anand, Minh Canh Vu, Dineshkumar Mani, Jun‐Beom Kim, Tae‐Hyeong Jeong, M. A. Islam, Sung‐Ryong Kim, Sung‐Ryong Kim
Topics & Concepts
Materials scienceComposite materialEMIElectromagnetic shieldingPolydimethylsiloxaneThermal conductivityGrapheneElectromagnetic interferenceElectronic packagingElectronic engineeringNanotechnologyEngineeringElectromagnetic wave absorption materialsDielectric materials and actuatorsFiber-reinforced polymer composites