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Research on the shape of ground wafer in Back Grinding of Wafer with Outer Rim

Xiaoguang Guo, Weihua Yao, Xianglong Zhu, Li Yu, Renke Kang

2021Materials Science in Semiconductor Processing18 citationsDOI

Topics & Concepts

WaferGrindingFlatness (cosmology)Materials scienceComposite materialOpticsMechanical engineeringEngineering drawingOptoelectronicsEngineeringPhysicsCosmologyQuantum mechanicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimization3D IC and TSV technologies
Research on the shape of ground wafer in Back Grinding of Wafer with Outer Rim | Litcius