A Novel Lining Method for Eliminating Plastic Deformation and Protrusion of Copper in Cu-TSV Using FEM Analysis
Yazdan Zare, Yasushi Sasajima, Jin Onuki
Topics & Concepts
CopperMaterials scienceExtrusionComposite materialDeformation (meteorology)MetallurgyFinite element methodThermalThermal analysisTitaniumYield (engineering)Stress (linguistics)Structural engineeringThermodynamicsEngineeringPhysicsLinguisticsPhilosophy3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties