Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load
Yang Liu, Chong Yao, Fenglian Sun, Hongyuan Fang
Topics & Concepts
Package on packageImage warpingInterconnectionSolderingDeformation (meteorology)Structural engineeringFinite element methodBall grid arrayMaterials scienceTemperature cyclingQuad Flat No-leads packageDie (integrated circuit)Stress (linguistics)Reliability (semiconductor)Composite materialMechanical engineeringThermalEngineeringLayer (electronics)Computer sciencePhilosophyLinguisticsArtificial intelligenceAdhesivePhysicsMeteorologyTelecommunicationsNanotechnologyQuantum mechanicsPower (physics)Wafer dicing3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdvancements in Photolithography Techniques