Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process
Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Topics & Concepts
WaferGrindingMaterials scienceSurface roughnessChipSurface finishRotational speedDiamondRandomnessMechanical engineeringComposite materialOptoelectronicsComputer scienceEngineeringMathematicsStatisticsTelecommunicationsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Measurement and Metrology Techniques