Study on curing kinetics of epoxy-amine to reduce temperature caused by the exothermic reaction
Zhipeng Ran, Xiaobing Liu, Xiaolian Jiang, Yeping Wu, Hong Liao
Topics & Concepts
EpoxyDiglycidyl etherExothermic reactionCuring (chemistry)Bisphenol AIsothermal processKineticsMaterials sciencePolymer chemistryEtherAmine gas treatingChemistryChemical engineeringComposite materialOrganic chemistryThermodynamicsPhysicsEngineeringQuantum mechanicsEpoxy Resin Curing ProcessesThermal and Kinetic AnalysisPhotopolymerization techniques and applications