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Machining, Characterization and Optimization: A Novel Approach for Machining Channels on Silicon Wafer Using Tailor-Made Micro Abrasive Jet Machining

Anu Tomy, Somashekhar S. Hiremath

2021Silicon12 citationsDOI

Topics & Concepts

MachiningMaterials scienceWaferBrittlenessAbrasiveSurface roughnessSiliconSurface finishComposite materialMechanical engineeringMetallurgyOptoelectronicsEngineeringAdvanced Surface Polishing TechniquesErosion and Abrasive MachiningDiamond and Carbon-based Materials Research
Machining, Characterization and Optimization: A Novel Approach for Machining Channels on Silicon Wafer Using Tailor-Made Micro Abrasive Jet Machining | Litcius