Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology—Sensing Head Interfacing
Shiying Chen, Damian Vilchis‐Rodriguez, Siniša Djurović, Mike Barnes, P. McKeever, Chunjiang Jia
Abstract
This paper assesses the suitability of the use of Fiber Bragg Grating Sensors for effective in-situ sensing of the IGBT junction temperature. To this end, the optical sensor is installed on the chip surface in a commercial IGBT module, enabling direct reading of its junction temperature. Two sensor interfacing configurations are evaluated by means of Finite Element simulations and experiments on a purpose designed laboratory test system. Experiments show the feasibility on the use of FBG sensing technology for reliable and effective real-time measurement of the junction temperature in a wide operating envelope of the tested IGBT device.
Topics & Concepts
Insulated-gate bipolar transistorInterfacingJunction temperatureTemperature measurementFiber Bragg gratingMaterials scienceChipElectronic engineeringOptical fiberReliability (semiconductor)ThermalOptoelectronicsElectrical engineeringEngineeringComputer scienceVoltageComputer hardwarePower (physics)Quantum mechanicsTelecommunicationsWavelengthPhysicsMeteorologySilicon Carbide Semiconductor TechnologiesThin-Film Transistor TechnologiesThermal Analysis in Power Transmission