An Underwater Robust-Adhesion Triboelectric Ion-Gel Enabled by Amphiphilic Copolymer Encapsulation and Water-Induced Interfacial Rearrangement
Yue Sun, Qiuxian Li, Wenxuan Peng, Chenchen Cai, Fangyuan Tang, Yongfei Liu, Qianggao Hu, Jinlong Wang, Bin Luo, Xusheng Li, Shuangxi Nie
Abstract
Water drives the electronic device adhesion interface to debonding, leading to attenuation or distortion of signals and limiting the potential for underwater applications. Here, a hydrophobic ion-gel (HIG) modeled on barnacle gum was developed by encapsulating the ionic liquid [BMIm]Cl in a copolymer formed by free radical quenching of a lignin–carbohydrate complex (LCC) and polythioctic acid (PTA). Due to the dynamic bonding and hydrophobic action to promote the strong underwater adhesion, and a hydrophobic lining hydration structure that improves the underwater stability, the resulting HIG exhibits superextensibility (maximum 10,286%), stable underwater conductivity (180 mS m –1 ), strong underwater adhesion (maximum 15 N/cm 2 ), and rapid underwater self-healing. It can be used as a single-electrode triboelectric sensor without the need for additional adhesives and encapsulation design and simply adheres to the glove, enabling durable sensing and communication under water. The proposed strategy offers a novel possibility for the material design of flexible and wearable underwater electronics.