Litcius/Paper detail

Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics

Jingli Ren, Mingliang Huang

2021Journal of Materials Science Materials in Electronics31 citationsDOI

Topics & Concepts

SolderingBall grid arrayMaterials scienceIntermetallicMicrostructureMetallurgyComposite materialElectronic packagingFailure mode and effects analysisDrop (telecommunication)Reflow solderingAlloyMechanical engineeringEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis
Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics | Litcius