Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging
Zhe Cui, Qiang Jia, Hongqiang Zhang, Yishu Wang, Limin Ma, Guisheng Zou, Fu Guo
Topics & Concepts
Reliability (semiconductor)Electronic packagingPower electronicsShear strength (soil)Materials scienceComposite materialNanoparticleElectronicsSolid-state physicsShear (geology)Engineering physicsPower (physics)Mechanical engineeringElectrical engineeringNanotechnologyEngineeringPhysicsCondensed matter physicsEnvironmental scienceThermodynamicsSoil waterSoil scienceVoltageElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies