Litcius/Paper detail

pMOSFET with CVD-grown 2D semiconductor channel enabled by ultra-thin and fab-compatible spacer doping

Terry Y.T. Hung, Mengzhan Li, Wei Sheng Yun, Sui An Chou, Shengkai Su, Edward Chen, San Lin Liew, Ying-Mei Yang, Kuang‐I Lin, Vincent Hou, T.Y. Lee, Han Wang, Albert M. K. Cheng, Minn‐Tsong Lin, H.‐S. Philip Wong, Iuliana Radu

20222022 International Electron Devices Meeting (IEDM)18 citationsDOI

Abstract

We present the first demonstration of p-MOSFET with a high ON current of $10^{-5}\mathrm{A}/\mathrm{u}\mathrm{m}$ and good S.S. $\sim 80\mathrm{m}\mathrm{V}/\mathrm{d}\mathrm{e}\mathrm{c}$. MOSFETs have the advantage of lower access resistance compared to Schottky barrier FETs. This requires spacer doping. Here, we introduce a self-limiting, fab-compatible process which consists of $\mathrm{W}\mathrm{O}_{\mathrm{x}}$ obtained from $\mathrm{W}\mathrm{S}\mathrm{e}_{2}$ by O <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> plasma conversion. We analyze the process condition which enhance the doping effect. We quantify the doping level and the impact of the channel bandgap. We demonstrate a self-aligned version of the spacer doping for MOSFET fabrication.

Topics & Concepts

DopingMOSFETLimitingMaterials scienceBand gapPhysicsCondensed matter physicsFabricationNanotechnologyOptoelectronicsQuantum mechanicsTransistorMechanical engineeringMedicinePathologyVoltageAlternative medicineEngineeringSemiconductor materials and devicesFerroelectric and Negative Capacitance DevicesAdvancements in Semiconductor Devices and Circuit Design