Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
Yangyang Lai, Ke Pan, Seungbae Park
Topics & Concepts
Reliability (semiconductor)Materials scienceReliability engineeringSubstrate (aquarium)Composite materialEngineering physicsMechanical engineeringElectronic engineeringEngineeringPhysicsGeologyThermodynamicsPower (physics)Oceanography3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies