Effects of Zn contents on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi-based lead-free solder

Yulong Li, Wei Lin, Xuewen Li, Hua Ouyang

2022Journal of Materials Science Materials in Electronics14 citationsDOI

Topics & Concepts

MicrostructureNanoindentationMaterials scienceSolderingEutectic systemUltimate tensile strengthPhase (matter)MetallurgyIndentationMelting temperatureComposite materialChemistryOrganic chemistryElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis