A hybrid thermal management system combining liquid cooling and phase change material for downhole electronics
Jiale Peng, Chao Deng, Fulong Wei, Siqi Ding, Run Hu, Xiaobing Luo
Topics & Concepts
ElectronicsElectronics coolingComputer coolingPhase-change materialHeat transferMechanical engineeringSpiral (railway)Transient (computer programming)Heat pipeWater coolingThermalMaterials scienceHeat exchangerPower electronicsEngineeringNuclear engineeringThermal management of electronic devices and systemsElectrical engineeringPhase changeMechanicsComputer scienceVoltageThermodynamicsEngineering physicsPhysicsOperating systemPhase Change Materials ResearchHeat Transfer and OptimizationHydraulic and Pneumatic Systems