Novel semi-N-methyl substituted bisbenzimidazole based polyimide films with low coefficient of thermal expansion and high Tg
Haiquan Chen, Fengna Dai, Xiaoying Yan, Chunhai Chen, Guangtao Qian, Youhai Yu
Topics & Concepts
Materials scienceThermal expansionPolyimideGlass transitionThermal stabilityBenzimidazolePolymerPolymer chemistryComposite materialChemical engineeringOrganic chemistryEngineeringLayer (electronics)ChemistrySynthesis and properties of polymersEpoxy Resin Curing ProcessesTribology and Wear Analysis