Performance analysis of Cu/CNT-based TSV: impact on crosstalk and power
Shivangi Chandrakar, Deepika Gupta, Manoj Kumar Majumder
Topics & Concepts
Materials scienceInductanceCapacitanceParasitic extractionCoaxialThrough-silicon viaCoaxial cableCarbon nanotubeBundleDielectricElectronic engineeringOptoelectronicsSiliconElectrical engineeringNanotechnologyVoltageComposite materialPhysicsConductorElectrodeEngineeringQuantum mechanics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesSemiconductor materials and devices