Tailoring the coefficient of thermal expansion of ternary nickel alloys through compositional control and non-contact measurements
Gianna M. Valentino, Jessica A. Krogstad, Timothy P. Weihs, Kevin J. Hemker
Topics & Concepts
Thermal expansionMaterials scienceMicroscale chemistryTernary operationTungstenMicroelectromechanical systemsThermal stabilityDesign for manufacturabilityNickelSiliconThin filmSputteringMetallurgyComposite materialNanotechnologyChemical engineeringMechanical engineeringComputer scienceMathematicsEngineeringMathematics educationProgramming languageMetal and Thin Film MechanicsElectronic Packaging and Soldering TechnologiesMetallurgical and Alloy Processes