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Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for Polydopamine-Graphene fillers in epoxy polymers

Zhijian Sun, Ryan Wong, Michael Yu, Jiaxiong Li, Mingyue Zhang, Lydia Mele, Jinho Hah, Mohanalingam Kathaperumal, Ching‐Ping Wong

2022Chemical Engineering Journal77 citationsDOI

Topics & Concepts

EpoxyMaterials scienceGrapheneNanocompositePolymerElectronicsPolymer nanocompositeSilaneNanotechnologyCoupling (piping)Composite materialChemistryPhysical chemistryThermal properties of materialsSynthesis and properties of polymersGraphene research and applications
Nanocomposites for future electronics device Packaging: A fundamental study of interfacial connecting mechanisms and optimal conditions of silane coupling agents for Polydopamine-Graphene fillers in epoxy polymers | Litcius