Hybrid solder joints: morphology and shear strength of Sn–3.0Ag–0.5Cu solder joints by adding ceramic nanoparticles through flux doping
Anna Aspalter, Angelika Cerny, Michael Göschl, M. Podsednik, G. Khatibi, A. Yakymovych, Yu. Plevachuk
Topics & Concepts
NanoceramicMaterials scienceSolderingCeramicComposite materialMicrostructureSolder pasteShear strength (soil)NanoparticleMetallurgyNanotechnologyEnvironmental scienceSoil scienceSoil waterElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties3D IC and TSV technologies