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Effect of Al2O3 Nanoparticle Addition on the Microstructure, Mechanical, Thermal, and Electrical Properties of Melt-Spun SAC355 Lead-Free Solder for Electronic Packaging

Hamed Al-sorory, Mohammed S. Gumaan, Rizk Mostafa Shalaby

2022Journal of Materials Engineering and Performance13 citationsDOI

Topics & Concepts

Materials scienceEutectic systemMicrostructureGrain boundarySolderingComposite materialGrain sizeGrain Boundary SlidingCrystalliteMetallurgyElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesMicrostructure and mechanical properties
Effect of Al2O3 Nanoparticle Addition on the Microstructure, Mechanical, Thermal, and Electrical Properties of Melt-Spun SAC355 Lead-Free Solder for Electronic Packaging | Litcius