Influence of Fe and Ho additions on Sn-3.0Ag-0.5Cu solder alloy: Microstructure, electrochemical and mechanical properties
Bin Chen, Xiaowu Hu, Wenjing Chen, Zezong Zhang, Jue Wang, Lan Jiang, Qinglin Li, Xiongxin Jiang
Topics & Concepts
Materials scienceMicrostructureAlloySolderingIndentation hardnessMetallurgyUltimate tensile strengthPhase (matter)CorrosionOptical microscopeElectrochemistryComposite materialScanning electron microscopeElectrodeChemistryOrganic chemistryPhysical chemistryElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisIntermetallics and Advanced Alloy Properties