Heat dissipation optimization and prediction for three-dimensional fan-out package
Jin-Feng Huang, Zhenzhi He, Chunxiao Li, Libo Zhao, Xiangning Lu
Topics & Concepts
Taguchi methodsThermal resistanceMaterials scienceJunction temperatureThermal conductionChipHeat transferThermalDissipationOptimal designComputer scienceMechanicsThermodynamicsComposite materialPhysicsMachine learningTelecommunicationsHeat Transfer and OptimizationThermal properties of materialsSilicon Carbide Semiconductor Technologies