Silicate glass-to-glass hermetic bonding for encapsulation of next-generation optoelectronics: A review
Laura Granados, R. Morena, Noboru Takamure, Tadatomo Suga, Shujuan Huang, David R. McKenzie, Anita Ho‐Baillie
Topics & Concepts
Materials scienceSilicateEncapsulation (networking)Anodic bondingMoistureSilicate glassOptoelectronicsComposite materialNanotechnologyLayer (electronics)Chemical engineeringComputer scienceEngineeringComputer network3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesSynthesis and properties of polymers