Evaluation of residual stress of metal micro structure electroformed with megasonic agitation
Liqun Du, Ke Zhai, Shuxuan Wang, Xi Zhang, Qiang Cao, Yikui Wen, Wenjun Zhao, Junshan Liu
Topics & Concepts
ElectroformingResidual stressNanoindentationMaterials scienceCantileverFabricationStress (linguistics)Composite materialStructural materialLayer (electronics)MetallurgyPathologyPhilosophyLinguisticsMedicineAlternative medicineMetal and Thin Film MechanicsElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering Technologies