Low temperature Ag-Ag direct bonding under air atmosphere
Leh-Ping Chang, Shin‐Yi Huang, Tao‐Chih Chang, Fan-Yi Ouyang
Topics & Concepts
Direct bondingMaterials scienceDissociation (chemistry)Direct shear testAnodic bondingThermogravimetric analysisThermocompression bondingComposite materialAtmosphere (unit)OxideGloveboxThermal diffusivityChemical engineeringChemistryMetallurgyShear (geology)SiliconPhysical chemistryLayer (electronics)ThermodynamicsOrganic chemistryEngineeringPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability