Litcius/Paper detail

Single crystal silicon wafer polishing by pretreating pad adsorbing SiO2 grains and abrasive-free slurries

Zhengzheng Bu, Fengli Niu, Jiapeng Chen, Zhenlin Jiang, Wenjun Wang, Xuehan Wang, Hanqiang Wang, Zefang Zhang, Yongwei Zhu, Tao Sun

2021Materials Science in Semiconductor Processing25 citationsDOI

Topics & Concepts

PolishingWaferAbrasiveMaterials scienceSlurryPotassium silicatePotassium hydroxideChemical-mechanical planarizationColloidal silicaSiliconPotassium carbonateMetallurgyCrystal (programming language)Composite materialChemical engineeringSodium silicateNanotechnologyChemistryEngineeringProgramming languageCoatingOrganic chemistryComputer scienceAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchForce Microscopy Techniques and Applications