Can Adhesion Energy Optimize Interface Thermal Resistance at a Soft/Hard Material Interface?
Xiaxia Cheng, Dongyi He, Man Zhou, Ping Zhang, Shuting Wang, Linlin Ren, Rong Sun, Xiaoliang Zeng
Abstract
Thermal resistance at a soft/hard material interface plays an undisputed role in the development of electronic packaging, sensors, and medicine. Adhesion energy and phonon spectra match are two crucial parameters in determining the interfacial thermal resistance (ITR), but it is difficult to simultaneously achieve these two parameters in one system to reduce the ITR at the soft/hard material interface. Here, we report a design of an elastomer composite consisting of a polyurethane–thioctic acid copolymer and microscale spherical aluminum, which exhibits both high phonon spectra match and high adhesion energy (>1000 J/m 2 ) with hard materials, thus leading to a low ITR of 0.03 mm 2 ·K/W. We further develop a quantitative physically based model connecting the adhesion energy and ITR, revealing the key role the adhesion energy plays. This work serves to engineer the ITR at the soft/hard material interface from the aspect of adhesion energy, which will prompt a paradigm shift in the development of interface science.