Fused silica ablation by double ultrashort laser pulses with dual wavelength and variable delays
Kévin Gaudfrin, J. Lopez, Laura Gemini, Martin Delaigue, Clemens Hönninger, Rainer Kling, Guillaume Duchateau
Abstract
Today, glass and other similar dielectric materials are widely used in modern manufacturing. However, glass is a brittle and a heat sensitive material. Laser technology is used to process glass but quality and throughput are still a key issue. In the present paper, we investigate dual-wavelength double ultrashort laser pulses in order to control free electrons dynamics and subsequent ablation for fused silica processing, and further improve the understanding of this laser-material interaction. We used a high average power Yb-doped femtosecond laser source (100 W) with two optical lines exhibiting different pulse durations and wavelengths (500 fs at 515 nm; and 1 or 10 ps at 1030 nm) with various fluences and delays. The best configuration in terms of ablation efficiency is expected to take place when the green pulse first induces free electrons, followed by their heating by the red pulse. The obtained results are discussed in terms of optical transmission as well as ablated volume, and are compared with single pulse ablation. Our experimental results are supported by absorbed energy density calculations based on a model considering the two-color laser induced electron dynamics, including photoionization, laser heating of free electrons, and their recombination. We demonstrate that there is an optimal cooperating effect between the two sub-pulses for a 1-ps delay, nevertheless there is no beneficial effect in splitting the beam for optimizing fused silica ablation compared with the single-pulse green configuration.