Litcius/Paper detail

Maximizing filler content and manufacturing highly thermal conductive composite materials through eutectic liquefaction of epoxy resin

Y.H.C. Cha, Younggi Hong, Kyeong Pang, In Kim, Munju Goh

2024Journal of Industrial and Engineering Chemistry8 citationsDOI

Topics & Concepts

EpoxyEutectic systemFiller (materials)Composite numberMaterials scienceComposite materialLiquefactionComposite epoxy materialElectrical conductorThermalChemistryAlloyPhysicsOrganic chemistryMeteorologyThermal properties of materialsEpoxy Resin Curing ProcessesComposite Material Mechanics