A review on the mainstream through-silicon via etching methods
Haoming Guo, Shengbin Cao, Lei Li, Xiaofeng Zhang
Topics & Concepts
Etching (microfabrication)Materials scienceReactive-ion etchingLaser drillingInterconnectionNanotechnologyDry etchingIsotropic etchingThrough-silicon viaDrillingSiliconOptoelectronicsMetallurgyComputer scienceLayer (electronics)Computer networkSemiconductor materials and devicesNanowire Synthesis and Applications3D IC and TSV technologies