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Investigations on Electrical Parameters Degradations of p-GaN HEMTs Under Repetitive UIS Stresses

Sheng Li, Siyang Liu, Chi Zhang, Ningbo Li, Xinyi Tao, Jiaxing Wei, Long Zhang, Weifeng Sun

2020IEEE Journal of Emerging and Selected Topics in Power Electronics28 citationsDOI

Abstract

Electrical parameters degradations of p-GaN high-electron-mobility transistors (HEMTs) under repetitive unclamped-inductive-switching (UIS) stresses have been investigated in this article. With the help of the TCAD simulations, the experimental frequency-dependent conductance analyses ( G <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">p</sub> /ω), and the experimental capacitance analyses ( C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ds</sub> ), it is demonstrated that the trapping effects near the gate region and in the gate to drain access region dominate the degradations. Due to the extremely high-voltage bias during UIS stresses, the trapping of electrons happens near gate region, resulting in the positive shifts of threshold voltage ( V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> ), the degradations of ON-state resistance, the reductions of the gate leakage current, and the reductions of OFF-state leakage current ( I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dss</sub> ). Two experimental methods, the C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ds</sub> analyses and the G <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">p</sub> /ω analyses, are introduced to characterize the trapping effects in p-GaN HEMT for the first time. Nonetheless, the large current surging during UIS stresses enhances the impact ionization and leads to the increase in I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">dss</sub> . The analyses above have been validated by the TCAD simulation successfully. For switching parameters, such as the voltage rises/falls time, which should be considered when designing power electronic systems, the increase in V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> induced by the UIS stresses dominates the changes.

Topics & Concepts

High-electron-mobility transistorCapacitanceConductanceTransistorTrappingLeakage (economics)PhysicsMaterials scienceElectrical engineeringOptoelectronicsTopology (electrical circuits)VoltageCondensed matter physicsQuantum mechanicsEngineeringBiologyElectrodeEconomicsEcologyMacroeconomicsGaN-based semiconductor devices and materialsSemiconductor materials and devicesGa2O3 and related materials
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