Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging
Ran Li, Xiao Yang, Jian Li, Youqing Shen, Lixin Zhang, Ruqian Lu, Chunhui Wang, Xing Zheng, Hui Chen, Jujia Zhang
Topics & Concepts
Materials scienceMicroelectronicsComposite materialDielectricThermal conductivityPolymerConductivityElectrical conductorConductive polymerElectronic packagingNanotechnologyOptoelectronicsPhysical chemistryChemistryThermal properties of materialsDielectric materials and actuatorsAdvanced Sensor and Energy Harvesting Materials