Analysis of BGA Lead-Free solder joints failure behavior based on thermal shock testing
Xiaoxiao Song, Yongxia Chen, Yongxia Chen, Zewen Xiao, Yajun Chen, Yajun Chen
Topics & Concepts
Ball grid arraySolderingThermal shockLead (geology)Materials scienceShock (circulatory)ThermalStructural engineeringForensic engineeringComposite materialMetallurgyEngineeringGeologyMedicineThermodynamicsInternal medicinePhysicsGeomorphologyElectronic Packaging and Soldering TechnologiesIntegrated Circuits and Semiconductor Failure Analysis3D IC and TSV technologies