Litcius/Paper detail

A Tutorial on High-Density Power Module Packaging

Yuxiang Chen, Ange-Christian Iradukunda, H. Alan Mantooth, Zhong Chen, David Huitink

2022IEEE Journal of Emerging and Selected Topics in Power Electronics26 citationsDOI

Abstract

Transportation electrification in many forms along with continued grid modernization efforts is placing stringent requirements on volumetric and gravimetric power densities for power electronic converters, motor drives, and protection systems. These requirements flow down to more stringent specifications on power module packages that typically comprise these systems. For instance, the PowerAmerica (PA) Institute issued a module challenge in 2021 to develop a 1.7-kV/1600-A power module within a volume of 100 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> during case of one year. This article describes, in tutorial fashion, how to approach the design and realization of such an aggressive module. It begins from an overview of an application-driven development process of prototypes for power module, including design, fabrication, and evaluation. Then, the PA module is used as a development example to illustrate the detailed challenges faced in the multidimensional design space and explore the technologies and strategies for high-power, high-density module realization. Consequently, the knowledge involved can be transferred and facilitate the prototype development of new power modules.

Topics & Concepts

Realization (probability)Computer scienceProcess (computing)ConvertersPower (physics)Systems engineeringPower moduleElectrical engineeringElectrificationEmbedded systemSoftware engineeringEngineeringOperating systemVoltageElectricityMathematicsQuantum mechanicsPhysicsStatisticsSilicon Carbide Semiconductor TechnologiesAdvanced Battery Technologies ResearchElectromagnetic Compatibility and Noise Suppression