Cu@Ni core–shell nanoparticles prepared via an injection approach with enhanced oxidation resistance for the fabrication of conductive films
Yanping Fang, Xiangzhe Zeng, Yuanzhi Chen, Mingwei Ji, Hongfei Zheng, Wanjie Xu, Dong‐Liang Peng
Abstract
Building core-shell structures is a valuable method of enhancing the oxidation-resistance performance of Cu nanoparticles for practical applications in the field of printed circuit boards. In this study, Cu@Ni core-shell nanoparticles are synthesized via an injection solution approach utilizing Cu seeds produced during the reactions to induce the epitaxial growth of Ni shells. The thickness of the Ni shell can be controlled by varying the Cu:Ni molar ratios in the injected precursor solution, whereas changing the injection rate of the Cu precursor solution affects the size of the Cu seeds and thus controls the eventual size of the core-shell nanoparticles. Thermogravimetric analysis reveals a superior thermal stability against oxidation for Cu@Ni core-shell nanoparticles, as compared with Cu nanoparticles. The oxidation resistance of Cu@Ni conductive films increases with an increase in the Ni:Cu ratio, while the conductivity increases with a decrease in the Ni:Cu ratio. A relatively low resistivity of 27.4 µΩ cm is achieved for Cu@Ni conductive films. The results demonstrate that coating Cu nanoparticles with Ni shells via epitaxial growth can form closed shells with smooth surfaces which are valuable for Cu nanoparticles in applications where oxidation resistance is a requirement .