Nickel conductive adhesive based on bisphenol A epoxy resin modified by CTBN/dicyclopentadiene epoxy resin: Effects of epoxy resin structure on mechanical properties and thermal stability
Zikai Xiong, Chunxiu Yu, Danlei Jing, Yanhua Li, Yunkai Wang, Yongqing Hu, Junmei Guo, Wei Li, Junpeng Li, Junpeng Li
Topics & Concepts
EpoxyDicyclopentadieneChemistryBisphenol AAdhesiveThermal stabilityComposite epoxy materialComposite materialNickelPolymerOrganic chemistryPolymerizationMaterials scienceLayer (electronics)Epoxy Resin Curing ProcessesSynthesis and properties of polymersElectronic Packaging and Soldering Technologies