Comparison of Cu and Co Integration with Porous Low-k SiOCH Dielectrics
Yi-Lung Cheng, Hong-Chang Huang, Chih-Yen Lee, Giin-Shan Chen, Jau-Shiung Fang
Topics & Concepts
Materials scienceDielectricInterconnectionCopperCobaltPorosityLow-k dielectricDegradation (telecommunications)Reliability (semiconductor)Back end of lineSemiconductorConductorIntegrated circuitElectronic engineeringOptoelectronicsComposite materialMetallurgyComputer sciencePower (physics)EngineeringPhysicsComputer networkQuantum mechanicsCopper Interconnects and ReliabilitySemiconductor materials and devicesElectrodeposition and Electroless Coatings