Intrinsic and strain dependent ultralow thermal conductivity in novel AuX (X = Cu, Ag) monolayers for outstanding thermoelectric applications
Aadil Fayaz Wani, Shakeel Ahmad Khandy, Lokanath Patra, Marutheeswaran Srinivasan, Jaspal Singh, Atif Mossad Ali, Ishtihadah Islam, Shobhna Dhiman, Kulwinder Kaur
Abstract
for unstrained monolayers are 2.20 and 1.40, which enhances to 3.61 and 2.91 at 6% strain for AuCu and AuAg monolayers, respectively. Interestingly pudding-mold band textures are found to be responsible for this unusual thermoelectric behaviour. The stability concerns (chemical/dynamic/mechanical) of these monolayers are ensured to stimulate experimental determinations for novel synthesis and possible applications.
Topics & Concepts
MonolayerMaterials scienceThermoelectric effectThermal conductivityGrüneisen parameterPhononThermoelectric materialsCondensed matter physicsSeebeck coefficientDebye modelAnalytical Chemistry (journal)NanotechnologyThermodynamicsThermal expansionComposite materialChemistryOrganic chemistryPhysicsAdvanced Thermoelectric Materials and DevicesThermal properties of materials2D Materials and Applications