A phase-field study on thermo-mechanical coupled damage evolution and failure mechanisms of sintered silver interconnections
Yanpeng Gong, Yuguo Kou, Qiang Yue, Xiaoying Zhuang, Navid Valizadeh, Fei Qin, Qiao Wang, Timon Rabczuk
Topics & Concepts
Materials scienceField (mathematics)Phase (matter)Composite materialStructural engineeringEngineeringPhysicsMathematicsPure mathematicsQuantum mechanicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis