Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg
Chi Tan, Mohd Arif Anuar Mohd Salleh, Xin Fu Tan, Hideyuki Yasuda, Norainiza Saud, Mohd Izrul Izwan Ramli, Kazuhiro Nogita
Topics & Concepts
Materials scienceIntermetallicMicrostructureSolderingBall grid arrayNucleationGrain sizeSupercoolingJoint (building)AlloyMetallurgyComposite materialUltimate tensile strengthStructural engineeringThermodynamicsEngineeringPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAluminum Alloys Composites Properties