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Filling the gap: thermal properties and device applications of graphene

Rui Wu, Ruizhi Zhu, Shihui Zhao, Gang Zhang, He Tian, Tian‐Ling Ren

2021Science China Information Sciences23 citationsDOI

Topics & Concepts

GrapheneMiniaturizationThermal management of electronic devices and systemsThermal conductivityLimitingMaterials scienceElectronicsThermal conductionNanotechnologyThermalDissipationHeat sinkEngineering physicsComputer scienceMechanical engineeringEngineeringElectrical engineeringPhysicsMeteorologyThermodynamicsComposite materialThermal properties of materialsGraphene research and applicationsThermal Radiation and Cooling Technologies
Filling the gap: thermal properties and device applications of graphene | Litcius