Oriented Boron Nitride Nanosheet Films for Thermal Management and Electrical Insulation in Electrical and Electronic Equipment
Tianyu Wang, Guixin Zhang, Boya Zhang, Shuming Liu, Dayu Li, Liu Cheng
Abstract
Insulation failure and insufficient thermal management in electrical and electronic equipment threaten their safe and stable operation and restrict development toward high power and high integration. Improved insulation or thermal conductivity often sacrifices important physical properties. Moreover, the cost of these methods is high, and the potential for performance improvement is limited. This article reports a thin film of oriented boron nitride nanosheets (BNNSs) that can be obtained by simple self-assembly. The special structure of the film, which provides excellent insulation and thermal conductivity, introduces many shallow traps and promotes the tangential dissipation of charge on the polymer surface while maintaining high normal electrical strength. The maximum flashover voltage increase rate is 30.3%, which greatly improves the insulation level. The film has a low leakage current, dielectric constant, and dielectric loss. Experiments and simulations show that the reasonable heat conduction path in the film provides excellent heat conduction performance and the maximum tangential thermal conductivity of the film is 9.3 W/(m·K), which effectively improves the thermal management capability of the device. The film is utilized in electrical and electronic equipment and exhibits excellent performance; thus, it has an important role in improving the insulation and heat dissipation performance of the equipment.