Enhancing the thermal conductivity of epoxy molding compounds by adding SiO2-embedded carbon nanofibers for semiconductor packaging applications
Yeon-Ryong Chu, Zambaga Otgonbayar, Gyu-Sik Park, Suk Jekal, Hayeong Kim, Jiwon Kim, Yoon-Ho Ra, Seulki Song, Chang‐Min Yoon
Topics & Concepts
Materials scienceEpoxyNanochemistryThermal conductivityMolding (decorative)Composite materialSemiconductorCarbon nanofiberConductivityCarbon fibersCarbon nanotubeNanotechnologyOptoelectronicsChemistryPhysical chemistryComposite numberThermal properties of materialsCarbon Nanotubes in CompositesSynthesis and properties of polymers