Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint
Nurul Razliana Abdul Razak, Xin Fu Tan, Mohd Arif Anuar Mohd Salleh, Stuart D. McDonald, Michael Bermingham, Hideyuki Yasuda, Kazuhiro Nogita
Topics & Concepts
Materials scienceIntermetallicSolderingPorosityLiquid phaseJoint (building)Void (composites)Phase (matter)Shear strength (soil)Substrate (aquarium)Composite materialMetallurgyThermodynamicsStructural engineeringSoil waterSoil scienceEngineeringOrganic chemistryChemistryAlloyEnvironmental scienceGeologyPhysicsOceanographyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties