Litcius/Paper detail

Effect of Al Electrodes on Surface Passivation of TiO<sub><i>x</i></sub>Selective Heterocontacts for Si Solar Cells

Wensheng Liang, Parvathala Reddy Narangari, Jingnan Tong, J. Michel, Billy J. Murdoch, Hang Cheong Sio, Teng Kho, Felipe Kremer, Stephane Armand, Keith R. McIntosh, James Bullock, Kean Chern Fong

2022physica status solidi (RRL) - Rapid Research Letters14 citationsDOIOpen Access PDF

Abstract

This article presents a comprehensive study regarding the impact of the Al electrode on the surface passivation of three TiO x ‐based passivating selective contacts: TiO x :Al/LiF x /Al,TiO x /LiF x /Al, and a‐Si/TiO x :Al/LiF x /Al. A deterioration in passivation is recorded after the deposition of the Al electrode at close to room temperature, where the deterioration correlated to the Al thickness. A thin Al (10 nm) electrode resulted in the most severe passivation decline, while samples with a 100 nm Al electrode showed much less passivation deterioration. Furthermore, it is found that a low‐temperature annealing step led to a partial recovery of the passivation, particularly in the case of TiO x :Al/LiF x /Al and a‐Si/TiO x :Al/LiF x /Al contacts. The presented discovery in this article provides crucial insight into the importance of characterization and evaluation of passivating contacts, which is demonstrated here to be highly sensitive to the deposited metal thickness and the interfacial layers, as well as to the post‐deposition annealing.

Topics & Concepts

PassivationAnnealing (glass)Materials scienceElectrodeSiliconDeposition (geology)MetallurgyOptoelectronicsChemical engineeringAnalytical Chemistry (journal)NanotechnologyChemistryLayer (electronics)Physical chemistryEngineeringBiologyChromatographyPaleontologySedimentSilicon and Solar Cell TechnologiesSemiconductor materials and interfacesIntegrated Circuits and Semiconductor Failure Analysis