Intelligent diagnosis of flip chip solder joints with resolution enhanced SAM image
Xiangning Lu, Zhenzhi He, Héctor Gutiérrez, Guanglan Liao, Tielin Shi
Topics & Concepts
Flip chipArtificial intelligenceWavelet transformWaveletSolderingImage resolutionComputer scienceComputer visionMaterials scienceResolution (logic)ChipPattern recognition (psychology)TelecommunicationsLayer (electronics)AdhesiveComposite materialIntegrated Circuits and Semiconductor Failure AnalysisImage Processing Techniques and ApplicationsImage and Signal Denoising Methods