Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes
Shifei Han, Haijuan Yu, Chaojian He, Shusen Zhao, Chaoyu Ning, Lu Jiang, Xunchun Lin
Topics & Concepts
Materials scienceWaferLaserSilicon carbideDiamondEtching (microfabrication)OptoelectronicsRaster scanSlicingOpticsSiliconComposite materialLayer (electronics)Mechanical engineeringEngineeringPhysicsLaser Material Processing TechniquesDiamond and Carbon-based Materials ResearchAdvanced Surface Polishing Techniques