TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O
Mark T. Wade, Erik Anderson, Shahab Ardalan, Pavan Bhargava, Sidney Buchbinder, Michael L. Davenport, John M. Fini, Haiwei Lu, Chen Li, Roy Meade, C. Ramamurthy, Michael Rust, Forrest Sedgwick, Vladimir Stojanović, Derek Van Orden, Chong Zhang, Chen Sun, Sergey Shumarayev, Conor O’Keeffe, Tim Tri Hoang, David Kehlet, Ravi Mahajan, M.T. Guzy, Allen Chan, Tina Tran
Abstract
In this article, we present TeraPHY, a monolithic electronic-photonic chiplet technology for low power and low latency, multi-Tb/s chip-to-chip communications. Integration of the TeraPHY optical technology with open source advanced interconnect bus interface enables communication between chips at board, rack, and row level at the energy and latency cost of in-package interconnect. This enables the design of logically connected but physically separated large-scale and high-performance digital systems. The copackaging integration approach is demonstrated by integrating the TeraPHY die into the Intel Stratix10 FPGA multichip package.